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Cellular Base Station Integrated Circuits
Evolving Infrastructure Transceivers in 2G, 2.5G and 3G World Networks

This report addresses evolving transceiver architecture for 2G, 2.5G and 3G cellular infrastructure.Categorical quantitative and analytical assessments are given for mixed signal and digital ICs and infrastructure deployments. The assessments include semiconductor types, air interfaces and a breakdown by components. From software radios to the host of baseband processing solutions, this study places key technological strategies in perspective by targeting established and upcoming market players.





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  Release Date : August 11, 2001


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Scope of Study

Sources and Methodology

Notes

Section 1
Strategic Overview
 

    1.1 IC Reflections

    1.1.1 Infrastructure IC Forecast

    1.2 Supply Chain Politics

    1.3 Transformations

Section 2
Cellular Infrastructure
 

    2.1 Evolution of Cellular Services

    2.1.1 Overall Infrastructure Deployments

    2.1.2 Overall Infrastructure Shipments

    2.2 2.5G/3G Price Structure

    2.2.1 Packet-Based Pricing

    2.3 3G Spectrum

    2.3.1 UWC Proposal

    2.3.2 DECT Proposal

    2.3.3 Alternatives

    2.3.4 Spectrum and Licensing

    2.3.5 3G

    2.4 Overall Infrastructure Deployments and Shipments by Interface

    2.5 Infrastructure Capacity

    2.5.1 Deployments by Size: 2001 and 2006

    2.5.2 Shipments by Size: 2001 and 2006

    2.5.3 Channel Density of Shipments: 2001

    2.5.4 Channel Density of Shipments: 2006

    2.6 GSM/TDMA

    2.6.1 2G Systems: 2001

    2.7 GPRS

    2.7.1 2.5G Systems: 2001

    2.7.2 EDGE

    2.7.3 CDMA

    2.7.4 1XRTT and 3XRTT

    2.7.4.1 1XEV/1XEV-DO/1XEV-DV

    2.7.4.2 HDR

    2.8 WCDMA

    2.8.1 WCDMA Systems: 2001

    2.9 Emerging Opportunities for Smart Antennas

    2.9.1 Smart Antenna Forecast

Section 3
Architectures Defined and Devices in Progress
 

    3.1 Overview

    3.2 Assumptions Regarding Channel Capacity

    3.2.1 Base Station Shipments and Total Dedicated Channels: 2G

    3.2.2 Base Station Shipments and Total Dedicated Channels: 2.5G

    3.2.3 Base Station Shipments and Total Dedicated Channels: 3G

    3.2.4 Total Base Station Shipments and Dedicated Channels

    3.3 Software Defined Radios

    3.3.1 Receiver Partitioning

    3.3.2 Defining the Soft Radio

    3.3.3 Drawing Invisible Lines

    3.4 Direct Conversion

    3.5 Transceiver Costs for Varied Standards

    3.5.1 ASPs for 2G Transceiver Components

    3.5.2 ASPs for 2.5G Transceiver Components

    3.5.3 ASPs for 3G Transceiver Components

    3.6 Field Programmable Gate Array Issues

    3.7 Digital Signal Processors

    3.7.1 Architecture: VLIW and Super Scalar

    3.7.2 Modulation

    3.8 Neighborhood Rivalry: DSPs/ASICs/FPGAs

    3.9 Infrastructure IC Markets

    3.9.1 2G Infrastructure IC Markets: 2001

    3.9.2 2G Infrastructure IC Markets: 2006

    3.9.3 2.5G Infrastructure IC Markets: 2001

    3.9.4 2.5G Infrastructure IC Markets: 2006

    3.9.5 3G Infrastructure IC Markets: 2001

    3.9.6 3G Infrastructure IC Markets: 2006

    3.9.7 Total Infrastructure IC Markets: 2001 to 2006

    3.10 Unifying Baseband Functions

    3.10.1 Chip and Symbol Rate vs. Traditional Channel Card Architecture

    3.11 SAW Filters

    3.12 Low-Noise Amplifiers

    3.13 Phase-Locked Loop

    3.14 Codecs

    3.15 Memory

    3.16 Converters

    3.17 Variety of Silicon Processes

Section 4
Market Players and Influences
 

    4.1 Market Share

    4.2 Agere

    4.3 Agilent

    4.4 Alpha Industries

    4.5 Altera

    4.6 Anadigics

    4.7 Analog Devices

    4.8 Celeritek

    4.9 Chameleon

    4.10 Conexant

    4.11 Infineon

    4.12 Intel

    4.13 Intersil

    4.14 Lenslet

    4.15 M/A-COM

    4.16 Morphics

    4.17 Mitsubishi

    4.18 Motorola SPS

    4.19 National Semiconductor

    4.20 NEC/CEL

    4.21 Philips Semiconductor

    4.22 QUALCOMM

    4.23 RF Micro Devices

    4.24 Raytheon

    4.25 Texas Instruments

    4.26 Toshiba

    4.27 Triquint

    4.28 Vanu

    4.29 Watkins-Johnson (fka Samsung)

    4.30 Xilink

Tables and Charts 

    Infrastructure IC Market Value, World Market: 2001 to 2006

    Infrastructure Installed Base, World Market: 2001

    Infrastructure Shipments, World Market: 2001

    Infrastructure Installed Base Share by Interface, World Market: 2001

    Infrastructure Shipment Share by Interface, World Market: 2001

    Cellular Infrastructure Installed Base by Size, World Market: 2001

    Cellular Infrastructure Installed Base by Size, World Market: 2006

    Cellular Infrastructure Shipments by Size, World Market: 2001

    Cellular Infrastructure Shipments by Size, World Market: 2006

    Infrastructure Shipments by Size and Channel Density, World Market: 2001

    Infrastructure Shipments by Size and Channel Density, World Market: 2006

    Smart Antenna System Deployment for Cellular Infrastructure, World Market: 2000 to 2006

    Infrastructure Shipments by Standard and Channel Density, World Market: 2001

    ASPs for Individual 2G Transceiver Components: 2001

    ASPs for Individual 2.5G Transceiver Components: 2001

    ASPs for Individual 3G Transceiver Components: 2001

    2G Infrastructure IC Market Value by Type, World Market: 2001

    2G Infrastructure IC Market Value by Type, World Market: 2006

    2.5G Infrastructure IC Market Value by Type, World Market: 2001

    2.5G Infrastructure IC Market Value by Type, World Market: 2006

    3G Infrastructure IC Market Value by Type, World Market: 2001

    3G Infrastructure IC Market Value by Type, World Market: 2006

    Total Infrastructure IC Market Value by Type, World Market: 2001

    Total Infrastructure IC Market Value by Type, World Market: 2006

    ICs for Cellular Base Stations by Market Share, World Market: 2001

Appendix A
Company Directory
 

    Actel Corporation

    Advanced Micro Devices Inc

    Agere Systems

    Agilent Technologies, Communications Components Division

    Airnet

    Alpha Industries Inc

    Altera Corporation

    Amtel

    Anadigics Inc

    Analog Devices Inc

    Broadcom

    California Eastern Laboratories

    Celeritek Inc

    Conexant Systems Inc

    DSP Communications Inc

    e-tenna Corporation

    Filtronic Solid State

    Fujitsu Compound Semiconductor Inc

    Fujitsu Microelectronics Inc, Semiconductor Division

    Harris Semiconductor

    Hexawave Inc

    Hitachi Semiconductor

    IBM, Microelectronics Division

    IC Works Inc

    Infineon Technologies Corporation

    Intel Corporation

    Intersil

    Lattice Semiconductor Corporation

    Lenslet

    M/A-COM Inc

    MicroWave Technology Inc

    Mini-Circuits

    Mitsubishi Electronic America Inc, Mitsubishi Electronic Device Group

    Morphics Technology Inc

    Motorola Inc, Semiconductor Products Sector

    National Semiconductor Corporation

    OKI Semiconductor

    Pacific Wireless

    Parker Vision

    Peregrine Semiconductor Corp

    Philips Semiconductors Inc

    PrairieComm

    Proxim Inc

    QUALCOMM Inc, ASIC Products

    Raytheon Microelectronics

    RF Micro Devices Inc

    Richardson Electronics Ltd, Solid State & Components Group

    Silicon Laboratories

    SiRF Technology

    Sony Electronics Inc, Semiconductor Business Division

    Stanford Microdevices Inc

    STMicroelectronics

    Temic Semiconductor GmbH

    Texas Instruments Inc

    Toshiba Semiconductor Operations

    TriQuint Semiconductor Inc

    TRW GaAs Telecom Products

    Vanu Inc

    Watkins-Johnson

    Xilinx Inc

    Zarlink Semiconductor

Appendix B
Acronym List


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