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3G / Cellular Integrated Circuits
Evolving From Components to Complete Solutions Across World Markets

Consolidation and convergence will reshape the market for cellular integrated circuits. Designers from the radio frequency, intermediate frequency and digital camps come together in their crafts and test the limits of present technology. Haste and uncertainty breed atmospheric tension for both handset producers and their component suppliers.

This report aims to present the dynamics of the flux. It provides an overall view of the cellular handset market and the movements leading to the doorstep of third generation technologies. More specifically, this study peels back the outer casing of current and future devices in an evaluation of communications subsystems.

Despite economic instability, IC suppliers have the opportunity to carve lucrative niches in the next generation marketplace. As true 3G handsets have yet to reach the public, component vendors must optimize designs. This study addresses types of integration from RF to baseband, and based on these conditions presents semiconductor value within 2G, 2.5G and 3G cellular handsets.

Whether voice capacity or data is the true inspiration for 3G, component level commotion results nonetheless. New demand for multimedia functionality raises the foundation of conventional cellular design and reinvents the roles of component suppliers. Modules, software radios, direct conversion receivers and advances in process technologies all further goals of greater integration.

The report presents the fundamental concerns in the construction of next generation cellular phones. Quantifying all segments of the marketplace, from the terminals to the ICs within each variety, this study tracks the progress in real terms.





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  Release Date : March 14, 2002


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Table of Contents

Scope of Study

Sources and Methodology

Notes

Section 1
Executive Summary

Section 2
Cellular/PCS Telephony: In Stages 

    2.1 Cellular/PCS Background

          2.1.1 Personal Communications Services

          2.1.2 Cellular/PCS System Overview

    2.2 2G Technologies

          2.2.1 Advanced Mobile Phone Service

                2.2.1.1 Digital AMPS

          2.2.2 Time-Division Multiple Access

          2.2.3 Code-Division Multiple Access

          2.2.4 Global System for Mobile
          Communications

    2.3 2G Handset Shipment Forecasts

          2.3.1 TDMA Handset Shipment Forecasts

          2.3.2 GSM Handset Shipment Forecasts

          2.3.3 AMPS Handset Shipment Forecasts

          2.3.4 CDMA Handset Shipment Forecasts

    2.4 2G Subscriber Forecasts

          2.4.1 TDMA Subscriber Forecasts

          2.4.2 GSM Subscriber Forecasts

          2.4.3 AMPS Subscriber Forecasts

          2.4.4 CDMA Subscriber Forecasts

    2.5 Cellular/PCS Uses

          2.5.1 Voice

          2.5.2 Short Messaging Service

          2.5.3 Wireless Application Protocol

          2.5.4 Data/Voice Terminals

    2.6 Next Generations of Cellular Services

          2.6.1 Network Delays

          2.6.2 GSM/TDMA Path to 2.5G and 3G

          2.6.3 General Packet Radio Services

                2.6.3.1 GPRS Subscribers

          2.6.4 EDGE

                2.6.4.1 EDGE Subscribers

          2.6.5 CDMA

                2.6.5.1 1X and 3X

                2.6.5.2 1XHDR

                2.6.5.3 1xEV

                2.6.5.4 IXRTT Subscribers

    2.7 2.5G and 3G Handset Shipment Forecasts

          2.7.1 GPRS Handset Shipment Forecasts

          2.7.2 CDMA 1XRTT Handset Shipment
          Forecasts

          2.7.3 EDGE Handset Shipment Forecasts

          2.7.4 WCDMA Handset Shipment Forecasts

    2.8 Third-Generation Cellular: 3G

          2.8.1 3G Spectrum and Licensing

          2.8.2 3G Standards

          2.8.3 WCDMA

          2.8.4 UWC Proposal

          2.8.5 3G as a Broadband Access Platform

          2.8.6 Service Providers

          2.8.7 Wireless Handset Market Share

    2.9 Truncated and Actual Wireless Internet Access

          2.9.1 HDML/SMS/WML

Section 3
ICs for Cellular Subscriber Units 

    3.1 Background

    3.2 Market Size

    3.3 Reference Points

          3.3.1 IC Content

                3.3.1.1 2G IC Market Value Forecasts

                3.3.1.2 2.5 and 3G IC Market Value
                Forecasts

                3.3.1.2.1 GPRS/EDGE, 1XRTT/3XRTT,
                W-CDMA

                3.3.1.2.2 W-CDMA

          3.3.2 Dollar Content per Phone

    3.4 Price Partitioning

          3.4.1 2G Prices per Functional Section

          3.4.2 1XRTT and GPRS Prices per
          Functional Section

          3.4.3 W-CDMA Prices per Functional
          Section

          3.4.4 Price Forecasts per Functional
          Section

          3.4.5 2G/2.5G/3G Market Forecasts
          According to Functional Section

    3.5 Level of Solution

          3.5.1 Single-Mode Analog

          3.5.2 Systematic Solutions

    3.6 The Migration

    3.7 The Demise of Discretes

          3.7.1 SAW Filters

          3.7.2 Low-Noise Amplifiers

          3.7.3 Power Amplifiers

          3.7.4 Single-Source Power Amplifiers

          3.7.5 Phase-Locked Loops

          3.7.6 Analog-to-Digital Potential

          3.7.7 Codecs

          3.7.8 Digital Signal Processors

    3.8 Battle for the Baseband

    3.9 Software Radios

    3.10 Processing at the Basic Level

          3.10.1 MIPS Multiplied

    3.11 Responding to Power Consumption

          3.11.1 Power Management Units

          3.11.2 Transmit Power

    3.12 Memory

    3.13 Aesthetics on Demand

    3.14 Evolution of Suppliers

    3.15 Requests from on High

    3.16 A Moving Market

    3.17 Market Share

    3.18 Suppliers

          3.18.1 Agilent

          3.18.2 Alpha Semiconductor

          3.18.3 Anadigics

          3.18.4 Analog Devices Inc

          3.18.5 Conexant

          3.18.6 Infineon

          3.18.7 Intel

                3.18.7.1 DSP Communications/Intel

          3.18.8 M/A-COM

          3.18.9 Mitsubishi

          3.18.10 Motorola SPS

          3.18.11 National Semiconductor

          3.18.12 NEC/CEL

          3.18.13 Parker Vision

          3.18.14 Philips

          3.18.15 Prairiecomm

          3.18.16 Qualcomm

          3.18.17 Raytheon

          3.18.18 RF Micro Devices

          3.18.19 Texas Instruments

          3.18.20 Toshiba

          3.18.21 Triquint

          3.18.23 Watkins-Johnson (FKA Samsung)

          3.18.24 ZarLink (FKA Mitel)

Section 4
Forms and Levels of Integration 

    4.1 The Integration Mindset

    4.2 Processes

    4.3 CIC Market by Semiconductor Process

          4.3.1 Silicon Sub Processes

          4.3.2 GaAs Subprocesses

                4.3.2.1 The Influence of GaAs

          4.3.3 Silicon Germanium

                4.3.3.1 The Strength of SiGe

    4.4 Direct-Conversion Receivers

    4.5 Modules

          4.5.1 Multichip Modules

          4.5.2 Power Modules

    4.6 Frequency and Function

    4.7 Subfunction

    4.8 RF

          4.8.1 RF IC Market Value Forecasts

    4.9 IF

          4.9.1 IF IC Market Value Forecasts

    4.10 Baseband

          4.10.1 Baseband IC Market Value
          Forecasts

    4.11 Partitioning

    4.12 Complete IC Solutions

    4.13 Singular ASICs

    4.14 Building-Block ICs

    4.15 Systems Solutions Cost

    4.16 Dollar Content for 3G and Other Data Enhanced Devices

    4.17 Performance Required for 3G

          4.17.1 Processing Power

          4.17.2 3G Form Factors

          4.17.3 Global Positioning Systems
          and Bluetooth

    4.18 Interpreting the Warning Signs

Appendix A
Company Directory 

    Advanced Micro Devices Inc (AMD)

    Agere Systems

    Agilent Technologies, Communications Components Division

    Alpha Industries Inc

    Anadigics Inc

    Analog Devices Inc (ADI)

    Broadcom

    California Eastern Laboratories (CEL)

    Celeritek Inc

    Conexant Systems Inc

    DSP Communications Inc

    e-tenna Corp

    Filtronic Solid State

    Fujitsu Compound Semiconductor Inc (FCSI)

    Fujitsu Microelectronics Inc, Semiconductor Division

    Harris Semiconductor

    Hexawave Inc

    Hitachi Semiconductor

    IBM Microelectronics Division

    IC Works Inc

    Infineon Technologies Corp

    Intel Corp

    Lucent Technologies Inc, Microelectronics Group

    M/A-COM Inc

    MicroWave Technology Inc (MWT)

    Mini-Circuits

    Mitsubishi Electronic America Inc, Mitsubishi Electronic Device Group

    Motorola Inc, Semiconductor Products Sector

    National Semiconductor Corp

    OKI Semiconductor

    Pacific Wireless

    Parker Vision

    Peregrine Semiconductor Corp

    Peregrine Semiconductor Corp

    Philips Semiconductors Inc

    PrairieComm

    Proxim Inc

    Qualcomm Incorporated, ASIC Products

    Raytheon Microelectronics

    RF Micro Devices Inc (RFMD)

    Richardson Electronics Ltd Solid State & Components Group

    Silicon Laboratories

    SiRF Technology

    Sony Electronics Inc Semiconductor Business Division

    Stanford Microdevices Inc

    STMicroelectronics

    Temic Semiconductor GmbH

    Texas Instruments Inc

    Toshiba Semiconductor Operations

    TriQuint Semiconductor Inc

    TRW GaAs Telecom Products

    WJ Communications

    Zarlink Semiconductor

Appendix B
Acronym List

Tables and Charts 

    ICs for Cellular/PCS/3G Phones, World Market: 2001 to 2006

    Cellular IC Total Market by Standard, World Market: 2001 and 2006

    Total Handsets Shipped by Classification: 2 / 2.5 / 3G, World Market: 2000 to 2006

    Total Handsets by Type, World Market: 2001

    Total Handsets by Type, World Market: 2006

    Total Mobile Wireless Subscribers, World Market: 2000 to 2006

    Mobile Subscribers By Air Interface, World Market: 2001

    Subscribers by Air Interface, World Market: 2006

    Cellular/PCS Handset Vendors, Global Market Share by Handsets Shipped: 2000

    Average Cellular IC Content by Standard, World Market: 2001 to 2006

    IC Total Content Value In Cellular/PCS/2.5G/3G Phones, World Market: 2001 to 2006

    IC Market by Handset Type, World Market: 2001

    IC Market by Handset Type, World Market: 2006

    Cellular IC Content of Functional Sections by Standard, World Market: 2001

    Cellular IC Content of Functional Sections by Standard, World Market: 2006

    Total Cellular IC Market, Breakdown by Standard and Respective IC Content, World Market: 2001

    Total Cellular IC Market, Breakdown by Standard and Respective IC Content, World Market: 2006

    2G Cellular IC Market Value by Functional Section,World Market: 2001

    GPRS/1XRTT Cellular IC Market Value by Functional Section,World Market: 2001

    W-CDMA Cellular IC Market Value by Functional Section,World Market: 2001

    ICs for Cellular/PCS Handsets by Market Share, World Market, 2001

    Cellular IC Market Value by Semiconductor, World Market: 2001

    ICs for Cellular/PCS Handsets by Sub Process, World Market: 2001

    Silicon ICs for Cellular/PCS Handsets by Process, World Market: 2001

    GaAs ICs for Cellular/PCS Handsets by Process, World Market: 2001

    Cellular IC Market Value by Functional Section, World Market: 2001

    Cellular IC Market Value by Functional Section, World Market: 2006

    Key RF Cellular Sub-Components, World Market: 2001

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